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FR4 4layer 2OZ Electronic Circuit Board Assembly Green soldermask surface ENIG/HASL External SSD PCBA Conveter Card

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ShenZhen KaiZhuo Electronic Technology Co.,Ltd

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FR4 4layer 2OZ Electronic Circuit Board Assembly Green soldermask surface ENIG/HASL External SSD PCBA Conveter Card

Brand Name : KAZ

Model Number : KAZA-007

Certification : UL&ROHS

Place of Origin : China

MOQ : 1 Unit

Payment Terms : T/T, Western Union, MoneyGram, L/C, D/A

Supply Ability : 2000 m2 / Month

Delivery Time : 10 ~ 20 wprking days

Packaging Details : P/P

Layer Count : 2 ` 30 Layers

Max Board Size : 600 mm x 1200 mm

Base Material for PCB : FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material

Rang of Finish Baords Thickness : 0.21-7.0mm

Minimum Line Width : 3mil (0.075mm)

Minimum Line Space : 3mil (0.075mm)

Minimum Hole Diameter : 0.10 mm

Finishing Treatment : HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.

Thickness Of Copper : 0.5-14oz (18-490um)

E-Testing : 100% E-Testing (High Voltage Testing); Flying Probe Testing

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SA -167 Mini PCI-E mSATA to USB 3.0 External SSD PCBA Conveter Card

1. Features of SSD PCBA

• Material: FR4 Tg180, 6-layer
• Minimum trace/space: 0.1mm
• Blind and buries via and via in pad
Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009

2. SSD PCBA capability

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than20%
Press-fit	Press range:0-50KN
Press-fit	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling

2. SSD PCBA Pictures

FR4 4layer 2OZ Electronic Circuit Board Assembly Green soldermask surface ENIG/HASL External SSD PCBA Conveter Card

Product Tags:

electronic pcb assembly

pcb board assembly

FR4 4layer 2OZ Electronic Circuit Board Assembly Green soldermask surface ENIG/HASL External SSD PCBA Conveter Card Images

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